AON3D HIPS

High Impact Polystyrene (HIPS) is an amorphous polymer used in the manufacture of packaging and household appliance applications for its toughness, heat resistance, and good stiffness. In additive manufacturing, HIPS is used as a support material for other low-temperature thermoplastics. AON3D HIPS has excellent compatibility with AON3D ABS Prime as a breakaway support material.

Printing Difficulty: Easy/Beginner

HIPS can be purchased from AON3D directly by contacting help@aon3d.com.

Technical Specifications

Material Safety Data Sheet

Technical Data Sheet

For more information on material safety and specific material properties, contact help@aon3d.com.

Physical Properties

Property Value Test Method
Density 1.04 g/cm³ ASTM D792
Melt Density @ 220ºC, 5kg 2.80 g/10 min ASTM D1238
Shrinkage Rate < 1% 0.40-0.70% mm/mm ASTM D955

*All data as reported by AON3D Technical Data Sheet dated 7/3/2020. Print conditions listed on the Technical Data Sheet.


Usage Notes

General Process Settings

For best results, process settings should be adjusted based on model geometry. If you require process development support, our Applications Engineering team can help! Send us a message at help@aon3d.com to consult with one of our Additive Manufacturing Specialists.

HIPS can be printed with the full range of nozzle sizes to produce support structures to match the dimensions and scale of the part being supported. Large, simple support structures can be printed at high speed, but a slower speed is recommended for small, complex, or delicate structures. Optimized Ooze Control settings will reduce the likelihood of excess HIPS material getting stuck in the part from oozing or stringing.

Setting AON-M2
Extrusion Temperature 220-250ºC
Bed Temperature 95ºC
Chamber Temperature 80ºC
Print Speed 40-100 mm/s
Nozzle Size 0.25-1.20 mm
Build Platform Kapton® tape with Nano Polymer Adhesive, High-Temperature Build Plate

When using the High-Temperature Build Plate with HIPS, increase bed temperature to 105ºC.

Setting AON-M2 2020
Extrusion Temperature 220-250ºC
Bed Temperature 95ºC
Chamber Temperature 80ºC
Print Speed 40-100 mm/s
Nozzle Size 0.25-1.20 mm
Build Platform Kapton® tape with Nano Polymer Adhesive, High-Temperature Build Plate

When using the High-Temperature Build Plate with HIPS, increase bed temperature to 105ºC.

Setting AON M2+
Extrusion Temperature 220-250ºC
Bed Temperature 95ºC
Chamber Temperature 80ºC
Print Speed 40-100 mm/s
Nozzle Size 0.25-1.20 mm
Build Platform PC build sheet, CF-PEEK composite plate

Moisture Control

HIPS is mildly susceptible to moisture uptake. When necessary, dry at 70ºC for at 4-6 hours in a convection oven. It is not necessary to protect HIPS from hydration while processing or to dry HIPS between prints, except in very humid environments. When not in use, store in a sealed package or container with silica desiccant to inhibit moisture absorption. Our drybox setup prevents filament moisture uptake to keep the material printing process free of moisture, contact help@aon3d.com for more information.

For more information, see the Filament Drying and Moisture Control guide.

Build Platform Adhesion

For instructions on how to inspect the AON3D build plates, refer to the Inspect and Clean Build Plates procedure.

Build Platform Selection

HIPS prints best on Kapton® tape with the use of Nano Polymer Adhesive, an applied adhesion aid. HIPS can also be printed on the High-Temperature Build Plate, although the bed temperature must be increased to 105ºC.

First Layer Settings

Very tall or very thin support structures, and support structures with a small first layer area on the bed, require increased first layer adhesion to remain stable throughout the print. Printing a brim around the support structure out of the model material can act as an anchor and improve stability. If using the High-Temperature Build Plate, avoid placing less stable support structures over the bolt holes.

First layer adhesion can be improved by increasing the Extrusion Temperature or reducing First Layer Speed. First Layer Height and First Layer Width must be balanced with the model material, but a value of 100-150% for both is generally sufficient for HIPS. Reduce first layer adhesion if you have trouble removing the part and/or you damage the Kapton® tape during part removal.

First Layer Extrusion Temperature First Layer Speed
240-250ºC 30-50 mm/s

For more information, see the Build Platform Adhesion guide.

Build Platform Selection

HIPS prints best on Kapton® tape with the use of Nano Polymer Adhesive, an applied adhesion aid. HIPS can also be printed on the High-Temperature Build Plate, although the bed temperature must be increased to 105ºC.

First Layer Settings

Very tall or very thin support structures, and support structures with a small first layer area on the bed, require increased first layer adhesion to remain stable throughout the print. Printing a brim around the support structure out of the model material can act as an anchor and improve stability. If using the High-Temperature Build Plate, avoid placing less stable support structures over the bolt holes.

First layer adhesion can be improved by increasing the Extrusion Temperature or reducing First Layer Speed. First Layer Height and First Layer Width must be balanced with the model material, but a value of 100-150% for both is generally sufficient for HIPS. Reduce first layer adhesion if you have trouble removing the part and/or you damage the Kapton® tape during part removal.

First Layer Extrusion Temperature First Layer Speed
240-250ºC 30-50 mm/s

For more information, see the Build Platform Adhesion guide.

PC Build Sheet

HIPS prints best on the PC build sheet, with very good adhesion to the sheet without special settings. Increasing the First Layer Height and First Layer Width helps achieve an even first layer.

If HIPS cannot be removed from the PC sheet by hand once printed, reduce the extrusion temperature to 230ºC for the first layer. Adjusting the Z offset so that the first layer is a little farther from the bed is also helpful, although it is more important to ensure the offset matches the other tool to successfully support the model.

CF-PEEK Composite Build Plate

HIPS can also be printed on the CF-PEEK composite plate although more care is needed to ensure good first layer adhesion. To successfully print HIPS on the CF-PEEK plate, reduce the First Layer Speed and increase the extrusion temperature for the first layer. Increase the First Layer Height and First Layer Width above 120%.

First Layer Settings

Very tall or very thin support structures, and support structures with a small first layer area on the bed, require increased first layer adhesion to remain stable throughout the print. Printing a brim around the support structure out of the model material can act as an anchor and improve stability. If using the High-Temperature Build Plate, avoid placing less stable support structures over the bolt holes.

First layer adhesion can be increased by increasing the Extrusion Temperature or reducing First Layer Speed. First Layer Height and First Layer Width must be balanced with the model material, but a value of 100-150% for both is generally sufficient for HIPS.

First Layer Extrusion Temperature First Layer Speed
240-250ºC 30-50 mm/s

For more information, see the Build Platform Adhesion guide.

Reducing the First Layer Speed may be necessary for support structures with a small or very thin first layer area to adhere to the build platform. Using a brim with 2-3 layers helps improve the stability of very tall and/or very thin support structures.

Dual Extrusion and Support

Dual tool printing with HIPS requires fine-tuning for optimal printing. HIPS may degrade when exposed to extrusion temperatures while the tool is idle for an extended period. If your model has a large layer size (200x200 mm or more), reduce the temperature of the tool to 200ºC while it is idle to avoid clogging the nozzle. Adding a wipe in the Tool Change Script will clean the tool head as it oozes and purges between each layer.

When paired with AON3D ABS Prime, AON3D HIPS is a very effective breakaway support material. For good support interface adhesion with the ABS, set the Upper and Lower Vertical Separation Layers to 0 and the Horizontal Offset From Part to half the nozzle size (0.30 mm for a 0.60 mm nozzle). It is very important to ensure the two tools are well-calibrated in XYZ axes. If the support structures are difficult to mechanically remove without damaging the part, reduce the density of the supports by reducing Support Infill Percentage and Dense Infill Percentage. The Horizontal Offset From Part can also be increased slightly, but this will reduce the efficacy of the support and the surface quality of the ABS part.

Design your parts to require little or no support material. Generally, it is better to avoid using any support material at all if the geometry permits it. Surfaces supported by HIPS are visible even with 0 Upper/Lower Layer Separation Layers.

If possible, match the model and support material color. Residue or material on the part may be less visible if the support structures are difficult to remove without damage.

For more information, see the Using Supports and Support Materials and Dual Extrusion guides.

Post-Processing

Allow all machine components to reach room temperature before proceeding further. Failure to allow components to cool down will result in thermal injury (burns) to personnel.

HIPS can be removed from the build platform using a spatula. Instructions for doing this can be found in the Build Platform Adhesion guide.

The ABS model tends to separate more easily from the build platform than HIPS support structures. If given a sudden impact, the part can often be detached from the bed and its lower support structures at the same time. The HIPS supports remain on the build platform and must be removed separately.

HIPS can be removed from the build platform using a spatula. Instructions for doing this can be found in the Build Platform Adhesion guide.

The ABS model tends to separate more easily from the build platform than HIPS support structures. If given a sudden impact, the part can often be detached from the bed and its lower support structures at the same time. The HIPS supports remain on the build platform and must be removed separately.

PC Build Sheet

HIPS parts can be peeled off the PC build sheet by hand at room temperature. The use of a spatula may be necessary, especially to remove a brim or skirt.

Avoid removing prints while the PC build sheet is still hot. If not cooled, permanent deformation of the PC build sheet may occur when removing a large part with a lot of contact area.

CF-PEEK Composite Plate

HIPS parts separate easily from the CF-PEEK composite plate by hand at room temperature. The use of a spatula can facilitate part removal if needed.

Support Removal

Wear protective eyewear and gloves when mechanically removing HIPS support structures from prints. HIPS can suddenly fracture, potentially causing injury to yourself from sharp structures.

We recommend mechanically breaking the support structures away from the model once the print has cooled. HIPS and ABS adhere well while hot during printing but separate cleanly once cooled. Support structures can be removed from the part by hand, following the instructions in the Breakaway Support section of the Using Supports and Support Materials guide.

HIPS is soluble when submerged in a d-limonene solution for a long period. However, due to similar chemical properties, the model material will also degrade if left for too long. Dissolution is not recommended as a support removal process for HIPS.


Troubleshooting

Filament Runout Sensor

Some customers have observed that natural (uncolored) HIPS is not consistently detected by the filament sensor; the sensor triggers briefly and intermittently as the natural HIPS continues to feed through it. While this has been accounted for in newer software releases, older versions of the Filament Runout Detection feature may cause an unnecessary print stop when the sensor is triggered incorrectly.

We recommend turning off the filament runout sensor to avoid any detecting issues while printing if you are going to print with natural HIPS. Navigate to the Settings Page and then turn OFF the Filament Runout Detection feature in the General Tab.

If you are going to print with the filament runout sensor turned OFF, ensure that you have enough filament for the print job to prevent nozzle damage. By setting the Filament density of the model and support material to 0 and 1.04 respectively, the factory file will only show the Plastic weight of the support material.

For more information, see the Filament Runout Detection Feature guide.

HIPS Stuck in Part

Inaccurate X and Y tool offset calibration may cause an interference between the model and support structure. Poor model and support structure contact and print quality can be mitigated by improving the relative positions of the two toolheads.

For more information, see the X and Y Tool Offset Calibration guide.

Nozzle Clogging

HIPS is susceptible to material degradation if left in the nozzle at extrusion temperatures for too long. Most commonly occurs when the toolhead idles for extended periods during tool changing. Decrease the support material toolhead temperature to 200ºC for large layer sizes (200x200mm or more) while it is idle to avoid clogging the nozzle.

For more information about decreasing the support material toolhead, see the Dual Extrusion guide.

Last modified: January 24, 2022